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Call For Participation: NOCS-13, Extended Registration Deadline

iCal Import
Start:
April 21, 2013
End:
April 24, 2013
Venue:
Tempe, Arizona

Submitted by Carole Wu
http://www.nocsymposium.org
CALL FOR PARTICIPATION

The 7th ACM/IEEE International Symposium on Networks-on-Chip

www.nocsymposium.org

April 21-24, 2013
Tempe, Arizona, USA

The International Symposium on Networks-on-Chip (NOCS) is the premier event
dedicated to interdisciplinary research on on-chip and chip-scale communication
technology, architecture, design methods, applications and systems. NOCS brings
together scientists and engineers working on NoC innovations and applications
from inter-related research communities, including computer architecture,
networking, circuits and systems, embedded systems, and design automation.

Deadline for Advanced Registration is Extended to April 15, 2013.

Scientific program
——————
Sunday April 21: Tutorials on (1) MILLIMETER (mm)-WAVE WIRELESS NoC AS
INTERCONNECTION BACKBONE FOR MULTICORE CHIPS: PROMISES AND
CHALLENGES and (2) AUTOMATIC DEADLOCK VERIFICATION IN WORMHOLE
NETWORK-ON-CHIPS.

Monday–Wednesday April 22-24: Conference Technical Sessions
Featured Keynote Talks
(1) HETEROGENEOUS INTERCONNECTS FOR HETEROGENEOUS COMPUTING
Professor Luca Benini (University of Bologna)

(2) UNDERSTANDING NETWORKS-ON-CHIP: A DECADE AND BEYOND
Professor Radu Marculescu (Carnegie Mellon University)

(3) COMMUNICATION CHALLENGES IN ACCELERATOR-RICH ARCHITECTURES
Dr. Ravishankar Iyer (Intel)
——————

Organizing Committee
General Co-Chairs:
Karam S. Chatha, Qualcomm Research, USA
Chita R. Das, Penn State University, USA
Finance Chair:
Sudeep Pasricha, Colorado State, USA
Registration Chair:
Mohammed Al Faruque, University of California- Irvine, USA
Publicity Chair:
Carole-Jean Wu, Arizona State University, USA
Program Co-Chairs:
John Bainbridge, Sonics Inc., USA
Natalie Enright Jerger, University of Toronto, CA
Publications Chair:
Paul Gratz, Texas A&M, USA
Tutorials/Demo Chair
Zhonghai Lu, KTH, Sweden
Industrial Chair
Umit Ogras, Intel, USA