Call for Papers: MEMOCODE 2025
https://memocode2025.github.io/
Submitted by Geovani Benita

MEMCODE 2025 – 23rd ACM/IEEE International Symposium on Formal Methods and Models for System Design (FMCPS)
Part of ESWEEK 2025
October 02-03, 2025, TAIPEI, TAIWAN

MEMOCODE, originally a forum on methods and models for hardware-software codesign, has become a privileged forum to discuss on formal methods and models for the design of cyber-physical system and the verification of its safety and security requirements (FMCPS).

MEMOCODE’25 is a part of ESWEEK 2025, which will take place in Taipei, Taiwan. Registered attendees can attend sessions in any of the online events, including the conferences (CASES, CODES+ISSS, EMSOFT), symposia, tutorials, workshops, and education classes.

https://memocode2025.github.io/
https://esweek.org/memocode/

Selected accepted papers will be invited to extend their accepted papers for a special edition in a journal such as the ACM Transactions on Embedded Computing Systems (ACM TECS). See more on this at the end of this CFP.

Topics of interest
MEMOCODE solicits research papers on formal methods in system design that address the foundations, engineering methods, tools, or experimental case studies. Research areas of interest include, but are not limited to, the following:

• Modeling Languages, Methods, and Tools
• Formal Methods and Tools
• Models and Methods for Developing Critical Systems
• Quantitative/Qualitative Reasoning
• Formal Methods/Models in Practice
• AI/LLM Assisted Formal Verification/testing

Important Dates
Abstract submission deadline: April 28, 2025; May 8, 2025;  May 23, 2025 (FINAL)
Paper submission deadline: May 5, 2025; May 23, 2025 (FINAL)
Notification of acceptance: Jul 8, 2025
 Final version of papers: August 11, 2025

Submissions
MEMOCODE’25 calls for three kinds of submissions: regular papers, late-breaking results, and tool presentations. All papers must be written in English and formatted according to the ACM Sigconf style conference template. A double-blind review process will be enforced. Authors must not reveal their identity directly or indirectly. Submission of papers is handled via HotCRP.

• Regular papers are no longer than ten (10) pages, excluding bibliography and appendices. They should describe original work that does not overlap with another publication or a submission under review or accepted for publication by any other conference or journal. Reviewers will check regular papers for the soundness and novelty of the proposed solutions.
• Tool papers are no longer than eight (8) pages, excluding bibliography and appendices. They should describe an existing and publicly available tool that implements relevant methods. The methods might have been published before, but the tool should not have been described in a tool paper previously. In addition to reviewing the paper, reviewers will assess the tool itself using inputs and a user’s manual provided by the authors on the tool’s web page.
• Late-breaking Results (LB) papers are no longer than four (4) pages, excluding bibliography and appendices. They should describe a promising and novel idea with a potential to get breakthrough in the field. Reviewers will judge the novelty of the idea, but do not yet expect proofs for the envisioned results.

For questions regarding technical submissions, feel free to contact one of the program committee co-chairs. All accepted papers (regular papers, late-breaking results, and tool papers) will be submitted for inclusion in ACM Digital Library. Publication in the proceedings is contingent on one author registering for and presenting the paper at the conference.

Outstanding Paper Award
A selection of papers will be recognized as outstanding papers and will be highlighted on the symposium website.

Special Edition for Journal
Selected accepted papers will be invited to extend their accepted papers (at least 30% extension over the accepted version) for a special edition in a journal such as the ACM Transactions on Embedded Computing Systems (ACM TECS) or Leibniz Transactions on Embedded Systems (LITES). Kindly follow the call for submissions for the special edition to check the relevant deadlines and timeline of the review process. Note that the extended version of the paper will go through a separate review process in the journal.

Organizing committee
General Chairs: 
Claire Pagetti, ONERA, France
Nan Guan, City University of Hong Kong

Program Chairs:
Srinivas Pinisetty, Indian Institute of Technology Bhubaneswar, India
Sudipta Chattopadhyay, Singapore University of Technology and Design

Keynote Speakers:
Sanjay Lall, Stanford University
Naijun Zhan, Peking University

Call for Papers: IEEE International Symposium on Emerging Metaverse (ISEMV 2025)
https://ieee-isemv.org/call-for-papers/
Submitted by Pavana Prakash

2nd IEEE International Symposium on Emerging Metaverse (ISEMV 2025),
co-located with The International Conference on Computer Vision (ICCV 2025).
October 19–20, 2025,
Honolulu, Hawaii, USA,

ISEMV 2025, organized by the IEEE Metaverse Initiative, will bring together experts from diverse fields to explore the convergence of the physical and digital worlds. The symposium will focus on critical technologies, applications, and societal impacts shaping the emerging Metaverse.

Key Dates:

• Paper Submission Deadline: May 16, 2025 (Anywhere on Earth)
• Notification of Acceptance: June 27, 2025
• Camera-Ready Submission: August 8, 2025

Topics of Interest include, but are not limited to:

• Artificial Intelligence and Large Language Models
• Extended Reality (XR), AR/VR/MR Interfaces
• Digital Twins and Cyber-Physical Systems
• Metaverse Architectures, Standards, and Interoperability
• Human-Centered Interaction and UX
• Data Processing, Visualization, and Management
• Ethical AI, Governance, and Algorithmic Safety
• Applications: Healthcare, Industry 5.0, Education (EduVerse), Smart Cities (CityVerse), and more

Submission Details:

• Paper length: 4 to 8 pages (excluding references)
• Format: IEEE conference style (LaTeX or Word)
• Accepted papers will be published in IEEE Xplore
• Authors are encouraged to share datasets via IEEE DataPort to enhance reproducibility and visibility

Submission portal: https://easychair.org
Full CFP and updates: https://ieee-isemv.org/call-for-papers/

Contact: isemv@ieee.org

Call for Papers: IEEE Cross-Disciplinary Conference on Memory-Centric Computing
https://ccmcc.eclectx.org/cfp.html
Submitted by Saugata Ghose

IEEE Cross-disciplinary Conference on Memory-Centric Computing (CCMCC)
Dresden, Germany
October 8–10, 2025
https://ccmcc.eclectx.org/cfp.html

The IEEE Cross-disciplinary Conference on Memory-Centric Computing (CCMCC) is a new conference that aims to bring experts from diverse fields together, all working on advancing memory-centric computing, including processing in memory and processing near memory. It is a platform for sharing new ideas, exchanging insights, and fostering collaboration. CCMCC’s mission is to accelerate innovation in memory-centric computing and its the integration into real-world applications.

We are soliciting papers across the entire memory-centric computing stack, from software to architecture to circuits and devices. You can see a broader list of topics on the CFP.

Abstracts are due June 2, with full drafts due on June 9. We are accepting both long (10-12 page) and short (4-6) page papers. Please consider submitting!