June 5, 2020
EMBEDDED SYSTEMS WEEK
Call for Work-in-Progress Papers
CASES * CODES+ISSS * EMSOFT * Trustworthy IoT Day * NOCS * Workshops * Tutorials
Virtual Conference, September 20 – 25, 2020
Submission: June 5, 2020
* ESWEEK is going virtual:
In light of the continued uncertainty surrounding the Covid-19 situation, the safety and well-being of all the conference participants is our topmost priority. Therefore, the ESWEEK Steering Committee has decided to move to a virtual event format for this year to be held from Sept. 20-25. The 2020 paper review, WiP submission and acceptance processes will proceed normally. We are heartened by a more than 50% increase in number of submitted papers at ESWEEK this year that shows the resilience of our community. We will follow up with further details on conference registration, presentation formats, special sessions and tutorials.
About Embedded Systems Week (ESWEEK)
Embedded Systems Week (ESWEEK) is the premier event covering all aspects of hardware and software design for smart, intelligent and connected computing systems. By bringing together three leading conferences (CASES, CODES+ISSS, EMSOFT), one symposium (NOCS), and several workshops and tutorials, ESWEEK allows attendees to benefit from a wide range of topics covering the state of the art in embedded systems research and development.
Registered attendees can attend sessions in any of the ESWEEK conferences (CASES, CODES+ISSS, EMSOFT). Please note that tutorials, symposium (NOCS), and workshops may require separate registration.
– Paper Submission: June 5, 2020 (firm)
– Notification of Acceptance: July 6, 2020
WiP Paper Submission
ESWEEK 2020 continues a dual publication model comprising the Journal track and the Work-in-Progress (WiP) track. Journal track papers, which are full-length papers describing mature work, will be published in the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD). The WiP track papers, which are short (2-page) papers representing not-yet-mature but promising research, will be published in the ESWEEK proceedings and will be listed as regular publications within the IEEE and/or ACM digital libraries. Authors of WiP papers have the opportunity to publish the extended form of their work in any conference or journal they prefer. Journal and WiP papers are mutually exclusive, i.e., a work can only be in submission in one of the two tracks. For more information on the publishing process, refer to
CASES: International Conference on Compilers, Architectures, and Synthesis for Embedded Systems
CASES is a premier forum where researchers, developers and practitioners exchange information on the latest advances in compilers and architectures for high-performance, low-power embedded systems. The conference has a long tradition of showcasing leading edge research in embedded processor, memory, interconnect, storage architectures and related compiler techniques targeting performance, power, predictability, security, reliability issues for both traditional and emerging application domains. In addition, we invite innovative papers that address design, synthesis, and optimization challenges in heterogeneous and accelerator-rich architectures.
CASES Program Chairs:
Partha Pande, Washington State University, US
Umit Ogras, Arizona State University, US
CODES+ISSS: International Conference on Hardware/Software Codesign and System Synthesis
The International Conference on Hardware/Software Codesign and System Synthesis is the premier event in system-level design, modeling, analysis, and implementation of modern embedded and cyber-physical systems, from system-level specification and optimization down to system synthesis of multi-processor hardware/software implementations. The conference is a forum bringing together academic research and industrial practice for all aspects related to system-level and hardware/software co-design.
CODES+ISSS Program Chairs:
Roman Lysecky, University of Arizona, US
Jason Xue, City University of Hong Kong, HK
EMSOFT: International Conference on Embedded Software
The ACM SIGBED International Conference on Embedded Software (EMSOFT) brings together researchers and developers from academia, industry, and government to advance the science, engineering, and technology of embedded software development. Since 2001, EMSOFT has been the premier venue for cutting-edge research in the design and analysis of software that interacts with physical processes, with a long-standing tradition for results on cyber-physical systems, which compose computation, networking, and physical dynamics.
EMSOFT Program Chairs:
Timothy Bourke, Inria Paris, FR
Linh Thi Xuan Phan, University of Pennsylvania, US
ESWEEK 2020 General Chairs:
Tulika Mitra, National University of Singapore, SG
Andreas Gerstlauer, University of Texas Austin, US (Vice General Chair)
Petru Eles, Linköping University, SE (Past Chair)