ISLPED 2015 (Extended Deadline for Abstracts: Mar 1)

Final Submission Deadline
March 8, 2015

Submitted by Andreas Burg

International Symposium on Low Power Electronics and Design (ISLPED)

Rome, Italy
July 22 – July 24, 2015
Abstract Registration Deadline (extended): March 1st, 2015
Full paper submission Deadline: March 8th, 2015
Invited Talk, Panel, and Embedded Tutorial Proposals Deadline: April 1, 2015
Notification of Paper Acceptance: May 1, 2015
Submission of Camera-Ready Papers: June 1, 2015

Sponsored by the IEEE Circuits and Systems Society (CASS) and the ACM Special
Interest Group on Design Automation (SIGDA).

The International Symposium on Low Power Electronics and Design (ISLPED) is the
premier forum for presentation of innovative research in all aspects of low
power electronics and design, ranging from process technologies and
analog/digital circuits, simulation and synthesis tools, system-level design
and optimization, to system software and applications. Specific topics include,
but are not limited to, the following three main tracks and sub-areas:

1. Technology, Circuits, and Architecture

1.1. Technologies
Low-power technologies for Device, Interconnect, Logic, Memory,
2.5/3D, Cooling, Harvesting, Sensors, Optical, Printable, Biomedical,
Battery, and Alternative energy storage devices.

1.2. Circuits
Low-power digital circuits for Logic, Memory, Reliability, Clocking,
Power gating, Resiliency, Near-threshold and Sub-threshold,
Variability, and Digital assist schemes; Low-power analog/mixed-signal
circuits for Wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS,
Imaging, DC-DC converters, and Analog assist schemes.

1.3. Logic and Architecture
Low-power logic and microarchitecture for SoC designs, Processor cores
(compute, graphics and other special purpose cores), Cache, Memory,
Arithmetic/Signal processing, Cryptography, Variability, Asynchronous
design, and Nonconventional computing.

2. CAD, Systems, and Software

2.1. CAD Tools and Methodologies
CAD tools and methodologies for low-power and thermal-aware design
addressing power estimation, optimization, reliability and variation impact
on power, and power-down approaches at all levels of design abstraction:
physical, circuit, gate, register transfer, behavioral, and algorithm.

2.2. Systems and Platforms
Low-power, power-aware, and thermal-aware system design and platforms
for microprocessors, DSPs, embedded systems, FPGAs, ASICs, SoCs,
heterogeneous computing, data-center power delivery and cooling, and
system-level power implications due to reliability and variability.

2.3. Software and Applications
Energy-efficient, energy-aware, and thermal-aware system software and
application design including scheduling and management, power
optimizations through HW/SW interactions, and emerging low power
applications such as approximate and brain-inspired computing, the
Internet-of-Things (IoT), wearable computing, body-area/in-body networks,
and wireless sensor networks.

3. Industrial Design Track (New Initiative for 2015)

3.1. Industry Perspectives
For the first time, ISLPED’15 solicits papers for an “Industrial Design” track
to reinforce interaction between the academic research community and
industry. Industrial Design track papers have the same submission deadline
as regular papers and should focus on similar topics, but are expected to
provide a complementary perspective to academic research by focusing on
challenges, solutions, and lessons learnt while implementing industrial-
scale designs. In addition to purely hardware-focused papers, papers
describing power optimizations through an interaction of hardware and
software are also welcome.

Submissions should be full-length papers of up to 6 pages (PDF format, double-
column, US letter size, using the IEEE Conference format, available at
including all illustrations, tables, references, and an abstract of no more
than 250 words. Submissions must be anonymous. Submissions exceeding 6
pages or identifying the authors, either directly or through explicit references to
their prior work, will be automatically rejected. More information on paper
submission can be found at http://www.islped.org.

Submitted papers must describe original work that has not been
published/accepted or currently under review by another journal, conference,
symposium, or workshop at the same time. Accepted papers will be submitted to
the IEEE Xplore Digital Library and the ACM Digital Library. ISLPED’15 will
present two Best Paper Awards based on the ratings of reviewers and a panel of

There will be several invited talks by industry and academic thought
leaders on key issues in low power electronics and design. The Symposium
may also include embedded tutorials to provide attendees with the necessary
background to follow recent research results, as well as panel discussions
on future directions in low power electronics and design. Proposals for
invited talks, embedded tutorials, and panels should be sent by email to
the ISLPED’15 Technical Program Co-Chairs, Vijay Raghunathan (vr@purdue.edu)
and Ruchir Puri (ruchir@us.ibm.com) by the deadline listed above.

General Co-Chairs:
Luca Benini, Univ. of Bologna
Renu Mehra, Synopsys
Mauro Olivieri, Sapienza Univ.

Program Co-Chairs:
Ruchir Puri, IBM, ruchir@us.ibm.com
Vijay Raghunathan, Purdue Univ.

Local Arrangement Chair:
Alessandro Trifiletti, Sapienza Univ.

Industry Liaison:
David Garrett, Broadcom

Publicity Co-Chairs:
Andreas Burg, EPFL
Deming Chen, UIUC
Baris Taskin, Drexel University

Publication Chair:
Paul Wesling, IEEE

Industrial Design Track Co-Chairs:
Edith Beigne, CEA-Leti
Juergen Karmann, Infineon

Design Contest Co-Chairs:
Alberto Macii, Politecnico di Torino
Hiroki Matsutani, Keio University

Yu Wang, Tsinghua University

Web Chair:
Theo Theocharides, Univ. of Cyprus

Local Staff:
Francesco Menichelli, Sapienza Univ.
Antonio Mastrandrea, Sapienza Univ.
Zia Abbas Zaidi, Sapienza Univ.
Usman Khalid, Sapienza Univ.
Monica Coppola, FREEnergy