SELSE 2016

Final Submission Deadline
January 4, 2016

Submitted by William H. Robinson

The 12th IEEE Workshop on Silicon Errors in Logic – System Effects (SELSE 2016)
Austin, TX, USA
March 29 – 30, 2016
– Register an abstract: December 14, 2015
– Paper submission: January 4, 2016
– Authors notification: February 23, 2016
– Camera-ready submission: March 8, 2016

The growing complexity and shrinking geometries of modern manufacturing
technologies are making high-density, low-voltage devices increasingly
susceptible to the influences of electrical noise, process variation,
transistor aging, and the effects of natural radiation. The system-level
impact of these errors can be far- reaching. Growing concern about
intermittent errors, unstable storage cells, and the effects of aging are
influencing system design, and failures in memories account for a significant
fraction of costly product returns. Emerging logic and memory device
technologies introduce several reliability challenges that need to be
addressed to make these technologies viable. Additionally, reliability is a
key issue for large-scale systems, such as those in data centers and cloud
computing infrastructure.

The SELSE workshop provides a forum for discussion of current research and
practice in system-level error management. Participants from industry and
academia explore both current technologies and future research directions.
SELSE is soliciting papers that address the system-level effects of errors
from a variety of perspectives: architectural, logical, circuit-level, and
semiconductor processes. Case studies are also solicited.

Key areas of interest are (but not limited to):
– Technology trends and the impact on error rates.
– New error mitigation techniques.
– Characterizing the overhead and design complexity of error
mitigation techniques.
– Case studies describing the tradeoff analysis for reliable systems.
– Experimental data on failures in current and emerging technologies.
– System-level models: derating factors and validation of error
– Error handling protocols (higher-level protocols for robust system
– Characterization of reliability of systems deployed in the field and
mitigation of issues.
– Software-level impact of hardware failures.
– Software frameworks for resilience.

Authors are requested to register to submit a paper by December 14, 2015. The
paper submission deadline is January 4, 2016. Papers will be considered for
both oral and poster presentation, and all accepted submissions will be
distributed to SELSE participants. Authors will be notified by February 23,
2016. Final papers are due on March 8, 2016.

Additional information and guidelines for submission are available at
http://www.selse.org. Submissions and final papers should be in PDF following
IEEE two-column transactions format that does not exceed six printed pages of
text; the bibliography does not count against this page limit. Papers are not
made available through IEEE, and authors retain the copyright of their work.
Authors may optionally choose to make their presentations available online at
the workshop web site. Authors of papers selected for the DSN Best-of-SELSE
session will have the option to work with the DSN publications committee to
prepare the camera-ready versions for the DSN workshop proceedings.

There will be a special session at the 46th Annual IEEE/IFIP Conference on
Dependable Systems and Networks (DSN) in Toulouse, France dedicated for the
best papers of SELSE 2016. The selected SELSE papers will have the opportunity
to be presented in the special session and published in the DSN workshop

General Chairs:
Helia Naeimi, Intel
Dan Alexandrescu, iRoC

Program Chairs:
Sudhanva Gurumurthi, IBM/University of Virginia
Mattan Erez, The University of Texas at Austin

Finance Chairs:
Siva Hari, NVIDIA
Daniel Lowell, AMD

Publicity Chairs:
William H. Robinson, Vanderbilt University
Paolo Rech, UFRGS
Yiannakis Sazeides, University of Cyprus

Documents Chairs:
Mehdi Tahoori, Karlsruhe Institute of Technology
Mojtaba Ebrahimi, Karlsruhe Institute of Technology

Austin Industry Liaison:
Indrani Paul, AMD

Marios Kleanthous, Mesoyios College

Local Arrangements Chair:
Vijay Janapa Reddi, The University of Texas at Austin

Advisors to the Committee:
Sarah Michalak, LANL
Alan Wood, Oracle
Vilas Sridharan, AMD
Adrian Evans, iRoC