Call for Participation:

Hot Interconnects 2015

Early Registration Deadline
July 31, 2015
Refund Deadline
August 12, 2015

Submitted by Torsten Hoefler

23rd International Symposium on High Performance Interconnects
Oracle Santa Clara Agnews Campus
Santa Clara, California
August 26-28, 2015 (following Hot Chips)
Early Registration: Ends at 11:59 PM (PDT), July 31st, 2015
Last Day for Refunds: 11:59 PM (PDT), August 12, 2015.

Come join us for the 23rd annual IEEE Symposium on High-Performance
Interconnects (Hot Interconnects), to be held August 26-27 (with
tutorials on August 28), 2015, generously hosted by Oracle at the
historic Oracle Agnews Campus, Santa Clara, California.

Hot Interconnects (HotI) is the premier international forum for
researchers and developers of state- of-the-art hardware and
software architectures and implementations for interconnection
networks of all scales, ranging from multi-core on-chip
interconnects to those within systems, clusters, data centers, and
clouds. This yearly conference is attended by leaders in industry
and academia, creating a wealth of opportunities to interact with
individuals at the forefront of this field.

This year’s Hot Interconnects features keynotes from Oracle’s Vice
President of Hardware Development Rick Heatherington, and David
Meyer, the CTO and Chief Scientist of Brocade Communications. There
will be a great lineup of exciting talks, Intel will be discussing
their upcoming OmniPath technology, Facebook will discuss their
efforts in interconnects and VMWare will talk about NFV.

A panel “HPC vs. Datacenter Networks” discussing the intersection
of HPC networking technologies and Data center networking from
experts in both areas from world-leading companies and institutions
will provide a lively debate on what each group can learn from each
other and areas in which they are already converging.

There will be four technical paper sessions covering the cutting
edge in interconnect research and development on cross-cutting
issues spanning computer systems, networking technologies, and
communication protocols for high-performance interconnection
networks. This conference is directed particularly at new and
exciting technology and product innovations in these areas.

Building on last year’s successful technical program comprising
keynotes, technical sessions, and panels on networking for
data centers and high-performance computing, the 2015 edition of Hot
Interconnects will be located at Oracle Agnews Campus in Santa
Clara, CA. This year’s conference focuses on HPC Interconnects and
their use in traditional and non-traditional applications. We hope
you can join us.

A preliminary program and additional conference details are available

Fabrizio Petrini, IBM T.J. Watson

Technical Program Chairs:
Ada Gavrilovska, Georgia Tech
Ryan Grant, Sandia National Laboratories

Tutorial Chair:
Vikram Dham, Kamboi Technologies

Publication Chair:
Luca Valcarenghi, Scuola Superior Sant’Anna

Awards Chair:
Xin Huang, Cyan

Finance Chairs:
Madeleine Glick, University of Arizona
Xinyu Que, IBM T.J. Watson

Registration Chair:
Charlie Perkins, Huawei

Media Chair:
Torsten Hoefler, ETH Zurich

Local Arrangements Chair:
Don Draper, Oracle

Natalia Berezneva

Steering Committee:
Allen Baum, Mill Computing
Keren Bergman, Columbia University
Raj Channa, RBC Capital Markets
Lily Jow, Hewlett Packard
Mark Laubach, Broadcom
John Lockwood, Algo-Logic Systems
Fabrizio Petrini, IBM T.J. Watson
Dan Pitt, Open Networking Foundation